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Agilent HSDL-9001 Miniature Surface-Mount Ambient Light Photo Diode
Data Sheet
Description The HSDL-9001 is a low cost analog-output ambient light photo diode in lowest cost miniature Quad-Flat-No Lead (QFN) lead-free surface mount package. It consists of a photodiode, which peaks in human luminosity curve at 550 nm. Hence, it provides an excellent responsivity that is close to the response of human eyes, as shown in figure 2. It provides a design-alternative to the HSDL-9000 digital-output
ambient light photo sensor with infinite ambient light detection threshold control. Both the HSDL-9000 and HSDL-9001 are ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile appliances such as the mobile phones and PDAs that draw heavy current from the display backlighting will benefit from incorporating the HSDL-9000 and HSDL-9001 in their designs to reduce the power consumption significantly.
Features * Excellent responsivity which peaks in the human luminosity curve at 550 nm Close responsivity to the human eye * Miniature QFN surface-mount package Height - 0.60 mm Width - 2.00 mm Depth - 1.50 mm * Infinite ambient light detection threshold control * Guaranteed temperature performance -25C to 85C * VCC supply 2.7 to 3.6 V * Lead-free package Applications * Detection of ambient light to control display backlighting Mobile devices - mobile phones, PDAs Computing devices - notebooks, webpads Consumer devices - TVs, video cameras, digital still cameras * Daylight and artificial light exposed devices
Application Support Information The Application Engineering Group is available to assist you with the application design associated with HSDL-9001 Ordering Information Part Number HSDL-9001 Packaging Type Tape and Reel
infrared transceiver module. You can contact them through your local sales representatives for additional details.
Package 2-Pin QFN Package
Quantity 2500
Typical Application Circuit
Rf
C1 HSDL-9001 A K + - Rf iL - + Vo = -iL x Rf
Figure 1. Typical application for HSDL-9001.
I/O Pins Configuration Table Pin 1 2 Symbol K A I/O O I Description Cathode Anode Regulated, 2.7 to 3.6 Volts Notes
1.1 NORMALIZED RESPONSIVITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 350 450 550 650 750 850 950 1050 WAVELENGTH - nm HSDL-9000 SILICON EYE
Figure 2. Relative spectral response vs. wavelength.
2
Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature Supply Voltage Symbol TS TA VCC Min. -25 -25 2.7 Max. 85 85 3.6 Units C C V
Recommended Operating Conditions Parameter Operating Temperature Supply Voltage Symbol TA VCC Min. -25 2.7 Max. 85 3.6 Units C V
Electrical & Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25C with VCC at 3.0 V unless otherwise noted. Parameter Active Area Diameter Peak Wavelength Sensitivity Light Current Dark Current Breakdown Voltage Switching Time Symbol AD p Iph Id VB tr,tf 15 2 Min. Typ. 0.65 550 125 5 Max. Units mm2 nm nA nA V ms VCC = 0 V VCC = 3 V, Ev = 100 lux[1] VB = 3 V IB = 10 A VCC = 3 V, Ev = 500 lux, R = 500 k[2] Conditions
Notes: 1. Illuminance by CIE standard light source (Incandescent Lamp). 2. Fluorescent light is used as light source. However, white LED is substituted in mass production.
100.0
PHOTOCURRENT, Iph (nA)
700 600
SWITCHING TIME (ms)
80 70 60 50 40 30 20 10 0
DARK CURRENT (nA)
10.0
500 400 300 200 100 0 0 100 200 300 400 500 600 700 LUMINANCE, Ev (LUX)
1.0
0.1 0 10 20 30 40 50 60 70 80 90 100 AMBIENT TEMPERATURE (C)
0
500
1000
1500
2000
2500
LOAD RESISTANCE (k)
Figure 3a. Dark current vs. temperature.
Figure 3b. Luminance vs. photocurrent.
Figure 4. Switching characteristics.
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HSDL-9001 Package Outline
PACKAGE IDENTIFICATION
2.0 0.1
1.2 0.1 0.4 0.1 0.6 0.1 1.5 0.1 0.8 0.1
PIN 1 2
SYMBOL CATHODE ANODE
4
HSDL-9001 Tape and Reel Dimensions
4 0.5 +0.1 1.5 0 2 0.5 1.13 0.1
POLARITY PIN 1 : Cathode 2.72 0.1 PIN 2 : Anode 0.25 0.02 0.75 0.1
3.5 0.05
+0.3 8 -0.1
2.39 0.1 4 0.1 PROGRESSIVE DIRECTION
EMPTY
(40 mm MIN.)
PARTS MOUNTED
LEADER
(400 mm MIN.)
EMPTY
(40 mm MIN.)
LABEL DETAIL A 0 62.5 -2.5 180 0.5 2.0 0.5 13.0 0.2 LABEL
24 0.5 DETAIL A 10.9 MAX +2 8.4 0
5
Moisture Proof Packaging All HSDL-9001 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 2a.
Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package In reels In bulk Temp. 60C 125C Time 20 hours 3 hours
Baking should only be done once.
UNITS IN A SEALED MOISTURE-PROOF PACKAGE
Recommended Storage Conditions Storage Temperature Relative Humidity 10C to 30C below 60% RH
PACKAGE IS OPENED (UNSEALED)
ENVIRONMENT LESS THAN 30C, AND LESS THAN 60% RH
YES
Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. If times longer than four weeks are needed, the parts must be stored in a dry box.
NO BAKING IS NECESSARY
YES
PACKAGE IS OPENED LESS THAN 672 HOURS
NO
PERFORM RECOMMENDED BAKING CONDITIONS
NO
Figure 5. Baking conditions chart.
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Reflow Profile
255
T - TEMPERATURE - (C)
MAX. 260C R3 R4
230 220 200 180 160 120 80 25 0 P1 HEAT UP 50 R1
R2
60 sec. MAX. ABOVE 217C
R5
100
150
200 P3 SOLDER REFLOW
250 P4 COOL DOWN
300
t-TIME (SECONDS) P2 SOLDER PASTE DRY
Figure 6. Reflow graph.
Process Heat Up Solder Paste Dry Solder Reflow Cool Down
Symbol P1, R1 P2, R2 P3, R3 P3, R4 P4, R5
T 25C to 160C 160C to 200C 200C to 255C (260C at 10 seconds max.) 255C to 200C 200C to 25C
Maximum T/time 4C/s 0.5C/s 4C/s -6C/s -6C/s
The reflow profile is a straightline representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different T/time temperature change rates. The T/time rates detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and I/O pins are heated to a temperature of 160C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4C per second to allow for even heating of both the PC board and HSDL9001 I/O pins.
Process zone P2 should be of sufficient time duration (60 to -120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200C (392F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255C (491F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescence of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic
growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200C (392F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed -6C per second maximum. This limitation is necessary to allow the PC board and transceiver's castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-9001.
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Appendix A : SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil Aperture
STENCIL APERTURE METAL STENCIL FOR SOLDER PASTE PRINTING
LAND PATTERN
SOLDER MASK
PCBA
Figure 7. Stencil and PCBA.
1.1 Recommended Land Pattern
0.9
MOUNTING CENTRE
1
1.15
1.2
0.5
0.6 2
0.45 0.9 PIN 1 2 SYMBOL CATHODE ANODE
UNITS: mm
Figure 8. Recommended land pattern.
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1.2 Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. Aperture opening for shield pad is as per land pattern.
APERTURE AS PER LAND DIMENSION 0.152
0.9 2.30
Figure 9. Solder stencil aperture.
1.3 Adjacent Land Keepout and Solder Mask Areas Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. Note: Wet/Liquid PhotoImageable solder resist/mask is recommended.
3.3
0.2 MIN.
1.9
UNITS: mm
Figure 10. Adjacent land keepout and solder mask areas.
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Appendix B: Optical Window Design for HSDL-9001 Optical Window Dimensions To ensure that the performance of the HSDL-9001 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photodiode, so that it will not affect the angular response of the HSDL-9001. This minimum dimension that is recommended will ensure at least a 35 light reception cone. If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic which makes use of total internal reflection to focus the light. The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figure 12 illustrates the two types of window that we have recommended which could either be a flat window or a flat window with light pipe.
WINDOW
DETECTOR
FLAT WINDOW
FLAT WINDOW with LIGHT PIPE
Figure 12. Recommended window design.
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The table and figure below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0 mm with a refractive index 1.585.
D1 TOP VIEW
T
WD L
D2
D1
Z HSDL-9001 PHOTODIODE
Figure 13. Recommended window dimensions.
WD: D1: T: L: D2: Z:
Working Distance between window front panel & HSDL-9001 Window Diameter Thickness Length of Light Pipe Light Pipe Diameter Distance between window rear panel and HSDL-9001
Recommended Dimension for Optical Window WD (T+L+Z) 1.5 2.0 2.5 3.0 Flat Window (L = 0.0) Z D1 0.5 2.25 1.0 3.25 1.5 4.25 5.00 5.00 Flat Window with Light Pipe (D2 = 1.5; z = 0.5) D1 L - - - - - - 2.5 1.5
All Dimensions are in mm.
The window should be placed directly on top of the photodiode to achieve better performance and if a flat window with a light
pipe is used, dimension D2 should be 1.5 mm (same size as the PIN) to optimize the performance of HSDL-9001.
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Optical Window Material The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be smooth, without any texture.
The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp. (USA) and Bayer Polymers Co., Ltd. (Thailand).
Recommended Plastic Material Material Number Makrolon LQ2647 Makrolon LQ3147 Makrolon LQ3187 Visible Light Transmission 87% 87% 85% Refractive Index 1.587 1.587 1.587
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2004 Agilent Technologies, Inc. January 22, 2004 5989-0615EN

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